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崗位職責(zé)： 1.Define package level 3D-NAND test flow, test methodology and test specification. 2.FT or BI program development, validation, upgrade and maintenance until mass production. 3.Evaluate and provide solutions for test time reduction. 4.Yield, failure analysis of package level test for test yield improvement. 5.High speed load board design, verification 任職資格 1.Bachelor or above good knowledge on semi-conduct and testing methodology. Flash memory product relevant experience will be a plus, especially for (3D) NAND product testing experience. 2.Familiar with programming language, e.g. C/C , Perl, Python, RTL, APG etc; directly experience on memory will be a plus. 3.Familiar with ATE test program development, memory ATE experience is preferred. 3.Team player with good interpersonal skills and able to work efficiently with multi-functional groups across different department and ""location"". 4.Good English communication skills including verbal and written. 5.Proactive, self-motivated, result/goal oriented and be willing to face pressure and challenge. 6.Be in good health and mental diathesis and be able to take challenging work.