與今日招聘企業(yè)隨時溝通
與今日招聘企業(yè)隨時溝通
崗位職責: 1.Define package level 3D-NAND test flow, test methodology and test specification. 2.FT or BI program development, validation, upgrade and maintenance until mass production. 3.Evaluate and provide solutions for test time reduction. 4.Yield, failure analysis of package level test for test yield improvement. 5.High speed load board design, verification 任職資格 1.Bachelor or above good knowledge on semi-conduct and testing methodology. Flash memory product relevant experience will be a plus, especially for (3D) NAND product testing experience. 2.Familiar with programming language, e.g. C/C , Perl, Python, RTL, APG etc; directly experience on memory will be a plus. 3.Familiar with ATE test program development, memory ATE experience is preferred. 3.Team player with good interpersonal skills and able to work efficiently with multi-functional groups across different department and ""location"". 4.Good English communication skills including verbal and written. 5.Proactive, self-motivated, result/goal oriented and be willing to face pressure and challenge. 6.Be in good health and mental diathesis and be able to take challenging work.
【工作職責】
1、仿真平臺流程規(guī)劃;
2、仿真驗證平臺搭建;
3、仿真方案編寫;
4、仿真用例開發(fā);
5、驗證自動化腳本編寫。
【任職要求】
1、教育背景:碩士及以上學歷,通信,計算機,電子技術,微電子等相關專業(yè)優(yōu)先;
2、工作經(jīng)驗:相關領域3年及以上經(jīng)驗;
3、有以下芯片項目經(jīng)歷者優(yōu)先:
1)交換類芯片(NPU/SWITCH/PTN);
2)MCU類芯片;
3)車規(guī)類芯片(工控);
4)安全類芯片;
5)PS/PM方向(交換)
4、技能要求:
1)熟悉芯片驗證相關流程;
2)具有方案文檔編寫能力;
3)熟練掌握SystemVerilog語言;
4) 熟悉UVM,具有獨立完成驗證平臺設計,運行調試能力;
5)熟練使用芯片驗證相關EDA軟件,如vcs/verdi等;
6)熟練掌握至少一種腳本語言,如python/perl/tcl;
7)有低功耗驗證經(jīng)驗者優(yōu)先;
8)有數(shù)?;旌戏抡娼?jīng)驗者優(yōu)先;
5、語言要求:英文熟練讀寫;
6、個性特征:有進取心,責任心和事業(yè)心。
免費求職
企業(yè)直招 不收取任何費用專業(yè)招聘
專人服務 入職速度快50%優(yōu)質服務
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